振盛达电子科技
 Z-startech Electronic
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AD-1331

AD-1331

Product Description
MATT AD-1331 is one component liquid epoxy adhesive, which has hotplate curability for better productivity of image sensor device. It is designed for bonding component providing excellent adhesion to various substrates.

Typical Application
Liquid Encapsulant, Bonding Adhesive

Property of Uncured Material
Color     Black
Viscosity Brookfield C&P HBDV-II,
Spindle #51, 25°C)  5 RPM   21,000 cps
Thixotropic Index   6
Work Life @ 25°C, days  3
Shelf Life @ -15°C, months  6

Physical Properties
Gel Time @ 100°C, Hot plate  30S
Hardness (Shore D)   85
Glass Transition Temperature (Tg)  55°C
Coefficient of Thermal Expansion
Below Tg  32 ppm/°C
Above Tg  145 ppm/°C
Moisture Absorption   1.51 %
(100°C / 100%, 1 hr)
Volume Cure Shrinkage 0.68 %

Recommended Cure Condition
20 minutes @ 60°C (Conventional Convection Oven)
OR 3 minutes @ 100°C (Hot Plate)

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Product Description
MATT AD-1331 is one component liquid epoxy adhesive, which has hotplate curability for better productivity of image sensor device. It is designed for bonding component providing excellent adhesion to various substrates.

Typical Application
Liquid Encapsulant, Bonding Adhesive

Property of Uncured Material
Color     Black
Viscosity Brookfield C&P HBDV-II,
Spindle #51, 25°C)  5 RPM   21,000 cps
Thixotropic Index   6
Work Life @ 25°C, days  3
Shelf Life @ -15°C, months  6

Physical Properties
Gel Time @ 100°C, Hot plate  30S
Hardness (Shore D)   85
Glass Transition Temperature (Tg)  55°C
Coefficient of Thermal Expansion
Below Tg  32 ppm/°C
Above Tg  145 ppm/°C
Moisture Absorption   1.51 %
(100°C / 100%, 1 hr)
Volume Cure Shrinkage 0.68 %

Recommended Cure Condition
20 minutes @ 60°C (Conventional Convection Oven)
OR 3 minutes @ 100°C (Hot Plate)