振盛达电子科技
 Z-startech Electronic
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DA-4001FS(51)

DA-4001FS(51)

Product Description
MATT DA-4051 is one component epoxy adhesive,which has high shear strength with image sensor die during high temperature bonding process such as hotbar or ACF bonding. It is designed to have high T.I and viscosity to prevent die rotation or tilt problem.

Typical Application
Bonding Adhesive

Property of Uncured Material
Color  Red
Specific Gravity 1.35
Viscosity (Brookfield C&P HBDV-II,
Spindle #51, 25°C)  5 RPM 14,000 cps
Thixotropic Index 2.6
Work Life @ 25°C, days 3
Shelf Life @ -15°C, months 6

Physical Properties
Gel time @ 100°C 22 S
Hardness (Shore D) 80
Glass Transition Temperature (Tg) 42 °C
Coefficient of Thermal Expansion
Below Tg 47 ppm/°C
Above Tg 170 ppm/°C
Moisture absorption  0.71 %
(100°C / 100%, 1 hr)
Volume Cure Shrinkage 1.44 %

Recommended Cure Condition
2 minutes @ 120°C (Hotplate)
30 minutes @ 85°C (Conventional Convection Oven)

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Product Description
MATT DA-4051 is one component epoxy adhesive,which has high shear strength with image sensor die during high temperature bonding process such as hotbar or ACF bonding. It is designed to have high T.I and viscosity to prevent die rotation or tilt problem.

Typical Application
Bonding Adhesive

Property of Uncured Material
Color  Red
Specific Gravity 1.35
Viscosity (Brookfield C&P HBDV-II,
Spindle #51, 25°C)  5 RPM 14,000 cps
Thixotropic Index 2.6
Work Life @ 25°C, days 3
Shelf Life @ -15°C, months 6

Physical Properties
Gel time @ 100°C 22 S
Hardness (Shore D) 80
Glass Transition Temperature (Tg) 42 °C
Coefficient of Thermal Expansion
Below Tg 47 ppm/°C
Above Tg 170 ppm/°C
Moisture absorption  0.71 %
(100°C / 100%, 1 hr)
Volume Cure Shrinkage 1.44 %

Recommended Cure Condition
2 minutes @ 120°C (Hotplate)
30 minutes @ 85°C (Conventional Convection Oven)