振盛达电子科技
 Z-startech Electronic
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IPRODUCT / 经营项目
DM-1020

DM-1020


Application
Liquid Encapsulant, Bonding Adhesive

Recommended Cure Condition
40 seconds @ 120°C (Hot Plate) OR 30 minutes @ 85°C (Conventional Convection Oven)

Viscosity
38,000 cps

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Application
Liquid Encapsulant, Bonding Adhesive

Recommended Cure Condition
40 seconds @ 120°C (Hot Plate) OR 30 minutes @ 85°C (Conventional Convection Oven)

Viscosity
38,000 cps