振盛达电子科技
 Z-startech Electronic
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IPRODUCT / 经营项目
TU-1928

TU-1928


Application

Underfill for BGA and CSP

Recommended Cure Condition
30 minutes @ 95°C (Conventional Convection Oven)

Viscosity
1,300 cps






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Application

Underfill for BGA and CSP

Recommended Cure Condition
30 minutes @ 95°C (Conventional Convection Oven)

Viscosity
1,300 cps