振盛达电子科技
 Z-startech Electronic
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IPRODUCT / 经营项目
AI-1531

AI-1531


Application
Liquid Encapsulant, Bonding Adhesive

Recommended Cure Condition
20 minutes @ 60°C (Conventional Convection Oven) OR 3 minutes @ 100°C (Hot Plate)

Viscosity
21,000 cps










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Application
Liquid Encapsulant, Bonding Adhesive

Recommended Cure Condition
20 minutes @ 60°C (Conventional Convection Oven) OR 3 minutes @ 100°C (Hot Plate)

Viscosity
21,000 cps